Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints: Fid-Bau Portal

Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints

He, H. / Xu, G. / Guo, F.

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Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints

He, H. / Xu, G. / Guo, F.

Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints

He, H. / Xu, G. / Guo, F.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

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Document information

Title:

Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints

Contributors:

He, H. (author) / Xu, G. (author) / Guo, F. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 45 ; 334-340

Publication date:

2010-01-01

Size:

7 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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