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The grain refinement mechanism of electrodeposited copper

Wang, G. / Jiang, Z. / Lian, J. / Jiang, Q.

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The grain refinement mechanism of electrodeposited copper

Wang, G. / Jiang, Z. / Lian, J. / Jiang, Q.

The grain refinement mechanism of electrodeposited copper

Wang, G. / Jiang, Z. / Lian, J. / Jiang, Q.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

The grain refinement mechanism of electrodeposited copper

Contributors:

Wang, G. (author) / Jiang, Z. (author) / Lian, J. (author) / Jiang, Q. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 24 ; 3226-3236

Publication date:

2009-01-01

Size:

11 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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