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`Spalling' of SAC Pb free solders when used with nickel substrates

Snugovsky, L. / Snugovsky, P. / Perovic, D.D. / Rutter, J.W.

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`Spalling' of SAC Pb free solders when used with nickel substrates

Snugovsky, L. / Snugovsky, P. / Perovic, D.D. / Rutter, J.W.

`Spalling' of SAC Pb free solders when used with nickel substrates

Snugovsky, L. / Snugovsky, P. / Perovic, D.D. / Rutter, J.W.

Access

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

`Spalling' of SAC Pb free solders when used with nickel substrates

Contributors:

Snugovsky, L. (author) / Snugovsky, P. (author) / Perovic, D.D. (author) / Rutter, J.W. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 25 ; 1296-1300

Publication date:

2009-01-01

Size:

5 pages

ISSN:

Type of media:

Article (Journal)

Type of material:

Print

Language:

English

Classification:

© Metadata Copyright the British Library Board and other contributors. All rights reserved.

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