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`Spalling' of SAC Pb free solders when used with nickel substrates
`Spalling' of SAC Pb free solders when used with nickel substrates
`Spalling' of SAC Pb free solders when used with nickel substrates
Snugovsky, L. (Autor:in) / Snugovsky, P. (Autor:in) / Perovic, D.D. (Autor:in) / Rutter, J.W. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 25 ; 1296-1300
01.01.2009
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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