Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization: Fid-Bau Portal

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, Y. C. / Yu, J. / Kang, S. K. / Shih, D. Y. / Lee, T. Y.

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Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, Y. C. / Yu, J. / Kang, S. K. / Shih, D. Y. / Lee, T. Y.

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, Y. C. / Yu, J. / Kang, S. K. / Shih, D. Y. / Lee, T. Y.

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Check availability in my library

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Document information

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Document information

Title:

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Contributors:

Sohn, Y. C. (author) / Yu, J. (author) / Kang, S. K. (author) / Shih, D. Y. (author) / Lee, T. Y. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 2428-2436

Publication date:

2004-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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