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Mechanical behavior of Au–In intermetallics for low temperature solder diffusion bonding

Lian, J. / Chun, S. J. / Goorsky, M. S. / Wang, J.

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Mechanical behavior of Au–In intermetallics for low temperature solder diffusion bonding

Lian, J. / Chun, S. J. / Goorsky, M. S. / Wang, J.

Mechanical behavior of Au–In intermetallics for low temperature solder diffusion bonding

Lian, J. / Chun, S. J. / Goorsky, M. S. / Wang, J.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Mechanical behavior of Au–In intermetallics for low temperature solder diffusion bonding

Contributors:

Lian, J. (author) / Chun, S. J. (author) / Goorsky, M. S. (author) / Wang, J. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 44 ; 6155-6161

Publication date:

2009-01-01

Size:

7 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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