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Thermal conducting property of SiCp-reinforced copper matrix composites by hot pressing

Wang, C. / Min, G. / Kang, S.-b.

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Thermal conducting property of SiCp-reinforced copper matrix composites by hot pressing

Wang, C. / Min, G. / Kang, S.-b.

Thermal conducting property of SiCp-reinforced copper matrix composites by hot pressing

Wang, C. / Min, G. / Kang, S.-b.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermal conducting property of SiCp-reinforced copper matrix composites by hot pressing

Contributors:

Wang, C. (author) / Min, G. (author) / Kang, S.-b. (author)

Published in:

JOURNAL OF COMPOSITE MATERIALS ; 45 ; 1849-1852

Publication date:

2011-01-01

Size:

4 pages

ISSN:

0021-9983

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.118

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