Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer: Fid-Bau Portal

Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer

Maity, J. / Pal, T.K. / Maiti, R.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer

Maity, J. / Pal, T.K. / Maiti, R.

Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer

Maity, J. / Pal, T.K. / Maiti, R.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Transient liquid phase bonding of 6061-15 wt-%SiCp in argon environment using Cu powder interlayer

Contributors:

Maity, J. (author) / Pal, T.K. (author) / Maiti, R. (author)

Published in:

MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 25 ; 1489-1494

Publication date:

2009-01-01

Size:

6 pages

ISSN:

0267-0836

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Maity, J. / Pal, T. K. / Maiti, R. | British Library Online Contents | 2010

Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer

Chen, R. / Zuo, D. / Wang, M. | British Library Online Contents | 2006

Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings

Cooke, Kavian O. / Khan, Tahir I. / Oliver, Gossett D. | Elsevier | 2011

Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings

Cooke, K.O. / Khan, T.I. / Oliver, G.D. | British Library Online Contents | 2012

Transient liquid phase bonding of steel using an Fe–B interlayer

Di Luozzo, N. / Fontana, M. / Arcondo, B. | British Library Online Contents | 2007