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    Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

    New search for: Maity, J.
    New search for: Pal, T. K.
    New search for: Maiti, R.

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    Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

    New search for: Maity, J.
    New search for: Pal, T. K.
    New search for: Maiti, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

    New search for: Maity, J.
    New search for: Pal, T. K.
    New search for: Maiti, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

    Contributors:

    Maity, J. (author) / Pal, T. K. (author) / Maiti, R. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 45 ; 3575-3587

    Publication date:

    2010-01-01

    Size:

    13 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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