Transient liquid phase diffusion bonding of 6061-13 vol.% SiCp composite using Cu powder interlayer: mechanism and interface characterization

Maity, J. / Pal, T. K. / Maiti, R. | British Library Online Contents | 2010

Improvement of Joint Strength of SiCp/Al Metal Matrix Composite in Transient Liquid Phase Bonding Using Cu/Ni/Cu Film Interlayer

Chen, R. / Zuo, D. / Wang, M. | British Library Online Contents | 2006

Transient liquid phase diffusion bonding Al-6061 using nano-dispersed Ni coatings

Cooke, K.O. / Khan, T.I. / Oliver, G.D. | British Library Online Contents | 2012

Transient liquid phase bonding of steel using an Fe–B interlayer

Di Luozzo, N. / Fontana, M. / Arcondo, B. | British Library Online Contents | 2007

Transient liquid phase bonding process using liquid phase sintered alloy as an interlayer material

Kwon, Y.-S. / Kim, J.-S. / Moon, J.-S. et al. | British Library Online Contents | 2000