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    Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding

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    Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding

    New search for: Kim, K.H.
    New search for: Hong, S.H.
    New search for: Cha, S.I.
    New search for: Lim, S.C.
    New search for: Kwon, H.C.
    New search for: Yoon, W.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding

    New search for: Kim, K.H.
    New search for: Hong, S.H.
    New search for: Cha, S.I.
    New search for: Lim, S.C.
    New search for: Kwon, H.C.
    New search for: Yoon, W.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Bonding Quality of Copper-Nickel Fine Clad Metal Prepared by Surface Activated Bonding

    Contributors:

    Kim, K.H. (author) / Hong, S.H. (author) / Cha, S.I. (author) / Lim, S.C. (author) / Kwon, H.C. (author) / Yoon, W.K. (author)

    Published in:

    Crystallographic Orientation Distribution and Related Properties in Advanced Materials II ; 787-792

    MATERIALS TRANSACTIONS ; 51

    Publication date:

    2010-01-01

    Size:

    6 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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