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Reliability Tests of Au-Metallized Ni-Based Ohmic Contacts to 4H-n-SiC with and without Nanocomposite Diffusion Barriers
Reliability Tests of Au-Metallized Ni-Based Ohmic Contacts to 4H-n-SiC with and without Nanocomposite Diffusion Barriers
Reliability Tests of Au-Metallized Ni-Based Ohmic Contacts to 4H-n-SiC with and without Nanocomposite Diffusion Barriers
Kuchuk, A.V. (author) / Guziewicz, M. (author) / Ratajczak, R. (author) / Wzorek, M. (author) / Kladko, V.P. (author) / Piotrowska, A. (author) / Bauer, A.J. / Friedrichs, P. / Krieger, M. / Pensl, G.
2010-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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