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    Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study

    New search for: Ghosh, M.
    New search for: Gunjan, M.K.
    New search for: Das, S.K.
    New search for: Kar, A.
    New search for: Ghosh, R.N.
    New search for: Ray, A.K.

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    Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study

    New search for: Ghosh, M.
    New search for: Gunjan, M.K.
    New search for: Das, S.K.
    New search for: Kar, A.
    New search for: Ghosh, R.N.
    New search for: Ray, A.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study

    New search for: Ghosh, M.
    New search for: Gunjan, M.K.
    New search for: Das, S.K.
    New search for: Kar, A.
    New search for: Ghosh, R.N.
    New search for: Ray, A.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of Mn on Sn-Ag-Cu ternary lead free solder alloy-Cu assembly: a comparative study

    Contributors:

    Ghosh, M. (author) / Gunjan, M.K. (author) / Das, S.K. (author) / Kar, A. (author) / Ghosh, R.N. (author) / Ray, A.K. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 26 ; 610-614

    Publication date:

    2010-01-01

    Size:

    5 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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