Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition: Fid-Bau Portal

Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition

Ahn, J.-H. / Kwon, S.-H. / Kim, J.-H. / Kim, J.-Y. / Kang, S.-W.

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Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition

Ahn, J.-H. / Kwon, S.-H. / Kim, J.-H. / Kim, J.-Y. / Kang, S.-W.

Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition

Ahn, J.-H. / Kwon, S.-H. / Kim, J.-H. / Kim, J.-Y. / Kang, S.-W.

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Check availability in my library

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Document information

Title:

Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition

Contributors:

Ahn, J.-H. (author) / Kwon, S.-H. (author) / Kim, J.-H. (author) / Kim, J.-Y. (author) / Kang, S.-W. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 26 ; 371-374

Publication date:

2010-01-01

Size:

4 pages

ISSN:

1005-0302

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

WU XIAOWEI / SUN JENNIFER Y / RICE MICHAEL R | European Patent Office | 2023

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