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    Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

    New search for: Chin, Y.T.
    New search for: Lam, P.K.
    New search for: Yow, H.K.
    New search for: Tou, T.Y.

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    Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

    New search for: Chin, Y.T.
    New search for: Lam, P.K.
    New search for: Yow, H.K.
    New search for: Tou, T.Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

    New search for: Chin, Y.T.
    New search for: Lam, P.K.
    New search for: Yow, H.K.
    New search for: Tou, T.Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

    Contributors:

    Chin, Y.T. (author) / Lam, P.K. (author) / Yow, H.K. (author) / Tou, T.Y. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 1304-1311

    Publication date:

    2010-01-01

    Size:

    8 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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