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Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements
Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements
Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements
Chin, Y.T. (author) / Lam, P.K. (author) / Yow, H.K. (author) / Tou, T.Y. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 25 ; 1304-1311
2010-01-01
8 pages
Article (Journal)
English
DDC:
620.11
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