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    The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders

    New search for: Pan, X.M.
    New search for: Zhao, N.
    New search for: Ding, R.F.
    New search for: Wei, G.L.
    New search for: Wang, L.
    New search for: Nie, J.-F.
    New search for: Morton, A.

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    The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders

    New search for: Pan, X.M.
    New search for: Zhao, N.
    New search for: Ding, R.F.
    New search for: Wei, G.L.
    New search for: Wang, L.
    New search for: Nie, J.-F.
    New search for: Morton, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders

    New search for: Pan, X.M.
    New search for: Zhao, N.
    New search for: Ding, R.F.
    New search for: Wei, G.L.
    New search for: Wang, L.
    New search for: Nie, J.-F.
    New search for: Morton, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders

    Contributors:

    Pan, X.M. (author) / Zhao, N. (author) / Ding, R.F. (author) / Wei, G.L. (author) / Wang, L. (author) / Nie, J.-F. / Morton, A.

    Published in:

    PRICM7 PART 2 ; 1385-1388

    MATERIALS SCIENCE FORUM ; 654/656

    Publication date:

    2010-01-01

    Size:

    4 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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