Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders
The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders
The Correlation between the Liquid Structure and the Solidification Microstructure of Sn-Cu Lead-Free Solders
Pan, X.M. (Autor:in) / Zhao, N. (Autor:in) / Ding, R.F. (Autor:in) / Wei, G.L. (Autor:in) / Wang, L. (Autor:in) / Nie, J.-F. / Morton, A.
01.01.2010
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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