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High-performance copper alloy films for barrierless metallization

Lin, C. H. / Leau, W. K. / Wu, C. H.

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High-performance copper alloy films for barrierless metallization

Lin, C. H. / Leau, W. K. / Wu, C. H.

High-performance copper alloy films for barrierless metallization

Lin, C. H. / Leau, W. K. / Wu, C. H.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

High-performance copper alloy films for barrierless metallization

Contributors:

Lin, C. H. (author) / Leau, W. K. (author) / Wu, C. H. (author)

Published in:

APPLIED SURFACE SCIENCE ; 257 ; 553-557

Publication date:

2010-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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