A platform for research: civil engineering, architecture and urbanism
Highly stable carbon-doped Cu films on barrierless Si
Highly stable carbon-doped Cu films on barrierless Si
Highly stable carbon-doped Cu films on barrierless Si
Zhang, X. Y. (author) / Li, X. N. (author) / Nie, L. F. (author) / Chu, J. P. (author) / Wang, Q. (author) / Lin, C. H. (author) / Dong, C. (author)
APPLIED SURFACE SCIENCE ; 257 ; 3636-3640
2011-01-01
5 pages
Article (Journal)
English
DDC:
621.35
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
High-performance copper alloy films for barrierless metallization
British Library Online Contents | 2010
|Thermal stability of barrierless Cu-Ni-Sn films
British Library Online Contents | 2014
|The Preparation for Cu(Sn) Films of Barrierless Interconnection
British Library Online Contents | 2010
|Design regulations for barrierless buildings
British Library Conference Proceedings | 2007
|Sputtered Cu Films Containing Various Insoluble Substances for Advanced Barrierless Metallization
British Library Online Contents | 2007
|