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Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy
Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy
Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy
Yuan, J.W. (author) / Pang, Y.H. (author) / Hu, Y.L. (author) / Sun, Q. (author) / Liu, D. (author) / Yang, Y.H. (author) / Kim, H. / Yang, J. / Sekino, T. / Anpo, M.
2010-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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