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Simulation Study for Effects of Cooling Rate on Microstructure Transition during Solidification of Liquid Metal Cu
Simulation Study for Effects of Cooling Rate on Microstructure Transition during Solidification of Liquid Metal Cu
Simulation Study for Effects of Cooling Rate on Microstructure Transition during Solidification of Liquid Metal Cu
Yi, X.-h. (author) / Cheng, S.-h. (author) / Zhong, Q.-h. (author) / Bu, S.-l. (author)
MATERIALS SCIENCE AND ENGINEERING -HANGZHOU- ; 32 ; 830-839
2014-01-01
10 pages
Article (Journal)
Unknown
DDC:
620.11
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