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Electroless Copper Plating on Ti~3SiC~2 Powder Surface Using Ascorbic Acid as a Reducing Agent
Electroless Copper Plating on Ti~3SiC~2 Powder Surface Using Ascorbic Acid as a Reducing Agent
Electroless Copper Plating on Ti~3SiC~2 Powder Surface Using Ascorbic Acid as a Reducing Agent
2010-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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