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    Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

    New search for: Joo, S. M.
    New search for: Kim, H. K.

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    Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

    New search for: Joo, S. M.
    New search for: Kim, H. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

    New search for: Joo, S. M.
    New search for: Kim, H. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Shear deformation behavior of a Sn-3Ag-0.5Cu single solder ball at intermediate strain rates

    Contributors:

    Joo, S. M. (author) / Kim, H. K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 528 ; 2711-2717

    Publication date:

    2011-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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