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    Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions

    New search for: El-Daly, A.A.
    New search for: Hammad, A.E.
    New search for: Fawzy, A.
    New search for: Nasrallh, D.A.

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    Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions

    New search for: El-Daly, A.A.
    New search for: Hammad, A.E.
    New search for: Fawzy, A.
    New search for: Nasrallh, D.A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions

    New search for: El-Daly, A.A.
    New search for: Hammad, A.E.
    New search for: Fawzy, A.
    New search for: Nasrallh, D.A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Microstructure, mechanical properties, and deformation behavior of Sn-1.0Ag-0.5Cu solder after Ni and Sb additions

    Contributors:

    El-Daly, A.A. (author) / Hammad, A.E. (author) / Fawzy, A. (author) / Nasrallh, D.A. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 43 ; 40-49

    Publication date:

    2012-01-01

    Size:

    10 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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