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    Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder

    New search for: Terashima, S.
    New search for: Takahama, K.
    New search for: Nozaki, M.
    New search for: Tanaka, M.

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    Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder

    New search for: Terashima, S.
    New search for: Takahama, K.
    New search for: Nozaki, M.
    New search for: Tanaka, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder

    New search for: Terashima, S.
    New search for: Takahama, K.
    New search for: Nozaki, M.
    New search for: Tanaka, M.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder

    Contributors:

    Terashima, S. (author) / Takahama, K. (author) / Nozaki, M. (author) / Tanaka, M. (author)

    Published in:

    MATERIALS TRANSACTIONS ; 45 ; 1383-1390

    Publication date:

    2004-01-01

    Size:

    8 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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