Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Hwang, Y. T. / Hong, H. G. / Seong, T. Y. et al. | British Library Online Contents | 2007

Improvement of the reverse leakage behavior of Ag-based ohmic contacts for GaN-based light-emitting diodes using MgZnO interlayer

Hong, H. G. / Song, J. O. / Lee, T. et al. | British Library Online Contents | 2006

Electrical and microstructural characteristics of Ge/Cu ohmic contacts to n-type GaAs

Aboelfotoh, M. O. / Oktyabrsky, S. / Narayan et al. | British Library Online Contents | 1997

Ohmic contacts to p-type InAs

Lysczek, E. M. / Robinson, J. A. / Mohney, S. E. | British Library Online Contents | 2006

Thermostable Ohmic Contacts on p-Type SiC

Kassamakova, L. / Kakanakov, R. / Nordell, N. et al. | British Library Online Contents | 1998