Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer: Fid-Bau Portal

Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Hwang, Y. T. / Hong, H. G. / Seong, T. Y. / Leem, D. S. / Lee, T. / Kim, K. K. / Song, J. O.

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Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Hwang, Y. T. / Hong, H. G. / Seong, T. Y. / Leem, D. S. / Lee, T. / Kim, K. K. / Song, J. O.

Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Hwang, Y. T. / Hong, H. G. / Seong, T. Y. / Leem, D. S. / Lee, T. / Kim, K. K. / Song, J. O.

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Title:

Electrical and thermal stability of Ag ohmic contacts for GaN-based flip-chip light-emitting diodes by using an AgAl alloy capping layer

Contributors:

Hwang, Y. T. (author) / Hong, H. G. (author) / Seong, T. Y. (author) / Leem, D. S. (author) / Lee, T. (author) / Kim, K. K. (author) / Song, J. O. (author)

Published in:

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING ; 10 ; 14-18

Publication date:

2007-01-01

Size:

5 pages

ISSN:

1369-8001

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.38152

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