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Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints
Lee, H. T. (author) / Chen, Y. F. (author) / Schwedt, A. (author) / Mayer, J. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 528 ; 3630-3638
2011-01-01
9 pages
Article (Journal)
English
DDC:
620.11
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