Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow: Fid-Bau Portal

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Yoon, J. W. / Kim, S. W. / Jung, S. B.

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Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Yoon, J. W. / Kim, S. W. / Jung, S. B.

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Yoon, J. W. / Kim, S. W. / Jung, S. B.

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Order at Subito €

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Document information

Title:

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Contributors:

Yoon, J. W. (author) / Kim, S. W. (author) / Jung, S. B. (author) / Kim, H. S. / Park, S.-Y. / Hur, B. Y. / Lee, S. W.

Published in:

Eco-Materials Processing & Design VI ; 289-292

MATERIALS SCIENCE FORUM ; 486/487

Publication date:

2005-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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