Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

    New search for: Chen, D.
    New search for: Ho, C. E.
    New search for: Kuo, J. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

    New search for: Chen, D.
    New search for: Ho, C. E.
    New search for: Kuo, J. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

    New search for: Chen, D.
    New search for: Ho, C. E.
    New search for: Kuo, J. C.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Current stressing-induced growth of Cu3Sn in Cu/Sn/Cu solder joints

    Contributors:

    Chen, D. (author) / Ho, C. E. (author) / Kuo, J. C. (author)

    Published in:

    MATERIALS LETTERS ; 65 ; 1276-1279

    Publication date:

    2011-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Effect of current stressing on the reliability of 63Sn37Pb solder joints

    Wu, B. Y. / Chan, Y. C. / Zhong, H. W. et al. | British Library Online Contents | 2007

    Relieving the current crowding effect in flip-chip solder joints during current stressing

    Liang, S. W. / Shao, T. L. / Chen, C. et al. | British Library Online Contents | 2006

    Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints

    Wang, X.J. / Zeng, Q.L. / Zhu, Q.S. et al. | British Library Online Contents | 2010

    Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

    Zhang, R. / Tian, Y. / Hang, C. et al. | British Library Online Contents | 2013

    Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints

    Hsu, C. m. / Chen, S. w. | British Library Online Contents | 2013

    Back to top