Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints: Fid-Bau Portal

Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

Zhang, R. / Tian, Y. / Hang, C. / Liu, B. / Wang, C.

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Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

Zhang, R. / Tian, Y. / Hang, C. / Liu, B. / Wang, C.

Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

Zhang, R. / Tian, Y. / Hang, C. / Liu, B. / Wang, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints

Contributors:

Zhang, R. (author) / Tian, Y. (author) / Hang, C. (author) / Liu, B. (author) / Wang, C. (author)

Published in:

MATERIALS LETTERS ; 110 ; 137-140

Publication date:

2013-01-01

Size:

4 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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