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Relieving the current crowding effect in flip-chip solder joints during current stressing

Liang, S. W. / Shao, T. L. / Chen, C. / Yeh, E. C. C. / Tu, K. N.

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Relieving the current crowding effect in flip-chip solder joints during current stressing

Liang, S. W. / Shao, T. L. / Chen, C. / Yeh, E. C. C. / Tu, K. N.

Relieving the current crowding effect in flip-chip solder joints during current stressing

Liang, S. W. / Shao, T. L. / Chen, C. / Yeh, E. C. C. / Tu, K. N.

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Check availability in my library

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Document information

Title:

Relieving the current crowding effect in flip-chip solder joints during current stressing

Contributors:

Liang, S. W. (author) / Shao, T. L. (author) / Chen, C. (author) / Yeh, E. C. C. (author) / Tu, K. N. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 21 ; 137-146

Publication date:

2006-01-01

Size:

10 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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