Effects of Cu/In ratio of electrodeposited precursor on post-sulfurization process in fabricating quaternary CuIn(S,Se)2 thin films: Fid-Bau Portal

Effects of Cu/In ratio of electrodeposited precursor on post-sulfurization process in fabricating quaternary CuIn(S,Se)2 thin films

Lai, Y. / Kuang, S. / Liu, F. / Yuan, Z. / Zhang, Z. / Li, Y. / Liu, J. / Wang, B. / Tang, D. / Li, J.

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Effects of Cu/In ratio of electrodeposited precursor on post-sulfurization process in fabricating quaternary CuIn(S,Se)2 thin films

Lai, Y. / Kuang, S. / Liu, F. / Yuan, Z. / Zhang, Z. / Li, Y. / Liu, J. / Wang, B. / Tang, D. / Li, J.

Effects of Cu/In ratio of electrodeposited precursor on post-sulfurization process in fabricating quaternary CuIn(S,Se)2 thin films

Lai, Y. / Kuang, S. / Liu, F. / Yuan, Z. / Zhang, Z. / Li, Y. / Liu, J. / Wang, B. / Tang, D. / Li, J.

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Title:

Effects of Cu/In ratio of electrodeposited precursor on post-sulfurization process in fabricating quaternary CuIn(S,Se)2 thin films

Contributors:

Lai, Y. (author) / Kuang, S. (author) / Liu, F. (author) / Yuan, Z. (author) / Zhang, Z. (author) / Li, Y. (author) / Liu, J. (author) / Wang, B. (author) / Tang, D. (author) / Li, J. (author)

Published in:

APPLIED SURFACE SCIENCE ; 257 ; 8360-8365

Publication date:

2011-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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