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    Influence of Ar+ Energy of Bombardment Cu Target and Low Energy Assisted Bombardment on Cu-W Thin Film Structure by Ion Beam Sputtering

    New search for: Ai, Y.P.
    New search for: Zeng, Y.Y.
    New search for: Liu, L.J.
    New search for: Huang, X.M.
    New search for: Zhou, T.P.
    New search for: Zhu, G.

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    Influence of Ar+ Energy of Bombardment Cu Target and Low Energy Assisted Bombardment on Cu-W Thin Film Structure by Ion Beam Sputtering

    New search for: Ai, Y.P.
    New search for: Zeng, Y.Y.
    New search for: Liu, L.J.
    New search for: Huang, X.M.
    New search for: Zhou, T.P.
    New search for: Zhu, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of Ar+ Energy of Bombardment Cu Target and Low Energy Assisted Bombardment on Cu-W Thin Film Structure by Ion Beam Sputtering

    New search for: Ai, Y.P.
    New search for: Zeng, Y.Y.
    New search for: Liu, L.J.
    New search for: Huang, X.M.
    New search for: Zhou, T.P.
    New search for: Zhu, G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Influence of Ar+ Energy of Bombardment Cu Target and Low Energy Assisted Bombardment on Cu-W Thin Film Structure by Ion Beam Sputtering

    Contributors:

    Ai, Y.P. (author) / Zeng, Y.Y. (author) / Liu, L.J. (author) / Huang, X.M. (author) / Zhou, T.P. (author) / Zhu, G.

    Published in:

    Advanced Materials and Computer Science ; 448-453

    KEY ENGINEERING MATERIALS ; 474/476

    Publication date:

    2011-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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