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Microstructure and Thermo-Physical Properties of TiB~2/Si-30Al Composite for Electronic Packaging Applications
Microstructure and Thermo-Physical Properties of TiB~2/Si-30Al Composite for Electronic Packaging Applications
Microstructure and Thermo-Physical Properties of TiB~2/Si-30Al Composite for Electronic Packaging Applications
2011-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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