Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics: Fid-Bau Portal

Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

Sobiech, M. / Kruger, C. / Welzel, U. / Wang, J.-Y. / Mittemeijer, E.J. / Hugel, W.

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Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

Sobiech, M. / Kruger, C. / Welzel, U. / Wang, J.-Y. / Mittemeijer, E.J. / Hugel, W.

Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

Sobiech, M. / Kruger, C. / Welzel, U. / Wang, J.-Y. / Mittemeijer, E.J. / Hugel, W.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Phase formation at the Sn/Cu interface during room temperature aging: Microstructural evolution, whiskering, and interface thermodynamics

Contributors:

Sobiech, M. (author) / Kruger, C. (author) / Welzel, U. (author) / Wang, J.-Y. (author) / Mittemeijer, E.J. (author) / Hugel, W. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 26 ; 1482-1493

Publication date:

2011-01-01

Size:

12 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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