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    Fracture behavior of Cu-cored solder joints

    New search for: Kim, Y.
    New search for: Choi, H.
    New search for: Lee, H.
    New search for: Shin, D.
    New search for: Moon, J.
    New search for: Choe, H.

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    Fracture behavior of Cu-cored solder joints

    New search for: Kim, Y.
    New search for: Choi, H.
    New search for: Lee, H.
    New search for: Shin, D.
    New search for: Moon, J.
    New search for: Choe, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fracture behavior of Cu-cored solder joints

    New search for: Kim, Y.
    New search for: Choi, H.
    New search for: Lee, H.
    New search for: Shin, D.
    New search for: Moon, J.
    New search for: Choe, H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Fracture behavior of Cu-cored solder joints

    Contributors:

    Kim, Y. (author) / Choi, H. (author) / Lee, H. (author) / Shin, D. (author) / Moon, J. (author) / Choe, H. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 46 ; 6897-6903

    Publication date:

    2011-01-01

    Size:

    7 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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