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The effect of interface debonding behaviors on the mechanical properties of microPCMs/epoxy composites
The effect of interface debonding behaviors on the mechanical properties of microPCMs/epoxy composites
The effect of interface debonding behaviors on the mechanical properties of microPCMs/epoxy composites
Wang, X. Y. (author) / Su, J. F. (author) / Wang, S. B. (author) / Zhao, Y. H. (author)
POLYMER COMPOSITES ; 32 ; 1439-1450
2011-01-01
12 pages
Article (Journal)
English
DDC:
620.192
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