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Novel Environmentally Friendly Technology for Electroless Copper Plating

Liu, W.-m. / Xiao, X. / Yi, X. / Cao, Y. / Yang, G.-l.

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Novel Environmentally Friendly Technology for Electroless Copper Plating

Liu, W.-m. / Xiao, X. / Yi, X. / Cao, Y. / Yang, G.-l.

Novel Environmentally Friendly Technology for Electroless Copper Plating

Liu, W.-m. / Xiao, X. / Yi, X. / Cao, Y. / Yang, G.-l.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Novel Environmentally Friendly Technology for Electroless Copper Plating

Contributors:

Liu, W.-m. (author) / Xiao, X. (author) / Yi, X. (author) / Cao, Y. (author) / Yang, G.-l. (author)

Published in:

MATERIALS PROTECTION -WUHAN- ; 44 ; 40-43

Publication date:

2011-01-01

Size:

4 pages

ISSN:

1001-1560

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.1

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