Research on Process of Palladium-Free Activation and Deposition for Electroless Nickel Plating on SiC~p/Al Composites: Fid-Bau Portal

Research on Process of Palladium-Free Activation and Deposition for Electroless Nickel Plating on SiC~p/Al Composites

Libo, L. / Maozhong, A. / Gaohui, W.

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Research on Process of Palladium-Free Activation and Deposition for Electroless Nickel Plating on SiC~p/Al Composites

Libo, L. / Maozhong, A. / Gaohui, W.

Research on Process of Palladium-Free Activation and Deposition for Electroless Nickel Plating on SiC~p/Al Composites

Libo, L. / Maozhong, A. / Gaohui, W.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Research on Process of Palladium-Free Activation and Deposition for Electroless Nickel Plating on SiC~p/Al Composites

Contributors:

Libo, L. (author) / Maozhong, A. (author) / Gaohui, W. (author)

Published in:

RARE METAL MATERIALS AND ENGINEERING ; 34 ; 320-323

Publication date:

2005-01-01

Size:

4 pages

ISSN:

1002-185X

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 669

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