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    Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

    New search for: Zhu, X.
    New search for: Liu, Y.
    New search for: Long, J.
    New search for: Liu, X.

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    Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

    New search for: Zhu, X.
    New search for: Liu, Y.
    New search for: Long, J.
    New search for: Liu, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

    New search for: Zhu, X.
    New search for: Liu, Y.
    New search for: Long, J.
    New search for: Liu, X.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives

    Contributors:

    Zhu, X. (author) / Liu, Y. (author) / Long, J. (author) / Liu, X. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 31 ; 64-70

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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