A platform for research: civil engineering, architecture and urbanism
Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives
RARE METALS -BEIJING- ENGLISH EDITION ; 31 ; 64-70
2012-01-01
7 pages
Article (Journal)
English
DDC:
669
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers
British Library Online Contents | 2004
|British Library Online Contents | 2011
|British Library Online Contents | 2016
|Electrically and Thermally Conductive Adhesives for Automotive Electronics
British Library Online Contents | 2007
|Evaluation of Stress in Electrically-Conductive Adhesives Used in Automotive Applications
British Library Online Contents | 2008
|