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    New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

    New search for: Kim, J.-M.
    New search for: Yasuda, K.
    New search for: Rito, M.
    New search for: Fujimoto, K.

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    New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

    New search for: Kim, J.-M.
    New search for: Yasuda, K.
    New search for: Rito, M.
    New search for: Fujimoto, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

    New search for: Kim, J.-M.
    New search for: Yasuda, K.
    New search for: Rito, M.
    New search for: Fujimoto, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    New Electrically Conductive Adhesives Filled with Low-Melting-Point Alloy Fillers

    Contributors:

    Kim, J.-M. (author) / Yasuda, K. (author) / Rito, M. (author) / Fujimoto, K. (author)

    Published in:

    Application of Nano-Structures Formed under Irradiation of Higher Energy Particles ; 157-160

    MATERIALS TRANSACTIONS ; 45

    Publication date:

    2004-01-01

    Size:

    4 pages

    ISSN:

    1345-9678

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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