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Mechanical and microstructural properties of SnAgCu solder joints

Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. / Ristolainen, E. O.

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Mechanical and microstructural properties of SnAgCu solder joints

Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. / Ristolainen, E. O.

Mechanical and microstructural properties of SnAgCu solder joints

Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. / Ristolainen, E. O.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Mechanical and microstructural properties of SnAgCu solder joints

Contributors:

Sundelin, J. J. (author) / Nurmi, S. T. (author) / Lepisto, T. K. (author) / Ristolainen, E. O. (author)

Published in:

MATERIALS SCIENCE AND ENGINEERING A ; 420 ; 55-62

Publication date:

2006-01-01

Size:

8 pages

ISSN:

0921-5093

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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