A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Low Temperature Wafer Level Adhesive Bonding Using BCB for Resonant Pressure Sensor
Low Temperature Wafer Level Adhesive Bonding Using BCB for Resonant Pressure Sensor
Low Temperature Wafer Level Adhesive Bonding Using BCB for Resonant Pressure Sensor
Li, Y.X. (author) / Chen, D.Y. (author) / Wang, J.B. (author) / Wang, X.
2012-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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