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Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package
Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package
Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package
Li, Y.X. (author) / Chen, D.Y. (author) / Wang, J.B. (author)
MATERIALS SCIENCE FORUM ; 694 ; 896-900
2011-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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