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Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints
Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints
Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints
Zhang, K.K. (author) / Wang, Y.L. (author) / Fan, Y.L. (author) / Zhao, G.J. (author) / Yan, Y.F. (author) / Zhang, X. (author) / Han, Y. / Wang, T. / Zhou, S.
2010-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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