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Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding
Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding
Reinforcement of Ag nanoparticle paste with nanowires for low temperature pressureless bonding
Peng, P. (author) / Hu, A. (author) / Zhao, B. (author) / Gerlich, A. P. (author) / Zhou, Y. N. (author)
JOURNAL OF MATERIALS SCIENCE ; 47 ; 6801-6811
2012-01-01
11 pages
Article (Journal)
English
DDC:
620.11
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