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    Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive

    New search for: Deng, H.
    New search for: Ueda, M.
    New search for: Yamamura, K.

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    Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive

    New search for: Deng, H.
    New search for: Ueda, M.
    New search for: Yamamura, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive

    New search for: Deng, H.
    New search for: Ueda, M.
    New search for: Yamamura, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Smoothing Mechanism of Reaction Sintered SiC in Plasma Assisted Polishing Using Ceria Abrasive

    Contributors:

    Deng, H. (author) / Ueda, M. (author) / Yamamura, K. (author)

    Published in:

    KEY ENGINEERING MATERIALS ; 516 ; 119-124

    Publication date:

    2012-01-01

    Size:

    6 pages

    ISSN:

    1013-9826

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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