A platform for research: civil engineering, architecture and urbanism
Surface Polishing of 2-Inch 4H-SiC Wafer Using Fe Abrasive Particles
Surface Polishing of 2-Inch 4H-SiC Wafer Using Fe Abrasive Particles
Surface Polishing of 2-Inch 4H-SiC Wafer Using Fe Abrasive Particles
Kubota, A. (author) / Ichimori, Y. (author) / Touge, M. (author)
KEY ENGINEERING MATERIALS ; 516 ; 487-491
2012-01-01
5 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Polishing Characteristics on Silicon Wafer Using Fixed Nano-Sized Abrasive Pad
British Library Online Contents | 2009
|Surface modification of nanocolloidal silica for use as polishing abrasive particles
British Library Online Contents | 2003
|Numerical-experimental study on polishing of silicon wafer using magnetic abrasive finishing process
British Library Online Contents | 2019
|Corrective Abrasive Polishing Processes for Freeform Surface
British Library Online Contents | 2009
|Vibration-Assisted Magnetic Abrasive Polishing
British Library Online Contents | 2007
|