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    Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

    New search for: Hu, X.
    New search for: Chen, W.
    New search for: Wu, B.

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    Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

    New search for: Hu, X.
    New search for: Chen, W.
    New search for: Wu, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

    New search for: Hu, X.
    New search for: Chen, W.
    New search for: Wu, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure and tensile properties of Sn–1Cu lead-free solder alloy produced by directional solidification

    Contributors:

    Hu, X. (author) / Chen, W. (author) / Wu, B. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 556 ; 816-823

    Publication date:

    2012-01-01

    Size:

    8 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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